The University of Iowa

OSTC

Optical Science and
Technology Center

UIMF Nanotechnology Training - Atomic Layer Deposition (ALD)

IATL 104

University of Iowa

Microfabrication Facility

Nanotechnology Training

 

ATOMIC LAYER DEPOSITION

Atomic Layer Deposition (ALD) is a “Nano” technology, allowing thin films of a few nanometers to be deposited in a precisely controlled way.

Atomic Layer Deposition (ALD) is a thin film deposition technique that is based on the sequential, self-limiting surface reaction based on the temporal separation of two or more reactants.

Key Applications: high-k gate oxides, capacitors, solar cells, organic semiconductors, microfluidic, MEMS, Bio MEMS, memristors

Date and venue: Feb. 11, 9:30 am, IATL 104

Training details:

Lecture: 9:30 – 10:45 am

Outline: Intro. to Plasma and Thermal ALD techniques

                Overview of Oxford ALD Instruments

                ALD Processes

                Key Applications

 

Hands-on Lab: 11:00 – 1 pm (IATL 174)

Instructors: Shawn Xu Ph.D., (Process Engineer, Oxford Instruments America)

                 Aju Jugessur Ph.D., (Director, University of Iowa Microfabrication Facility)

Register here

Program details here

Contact: aju-jugessur@uiowa.edu

Individuals with disabilities are encouraged to attend all University of Iowa sponsored events. If you are a person with a disability who requires an accommodation in order to attend this program, please contact the Optical Science & Technology Center in advance at 353-0974 or email OSTC@uiowa.edu.