The University of Iowa


Optical Science and
Technology Center

UIMF Nanotechnology Training - Atomic Layer Deposition (ALD)

IATL 104

University of Iowa

Microfabrication Facility

Nanotechnology Training



Atomic Layer Deposition (ALD) is a “Nano” technology, allowing thin films of a few nanometers to be deposited in a precisely controlled way.

Atomic Layer Deposition (ALD) is a thin film deposition technique that is based on the sequential, self-limiting surface reaction based on the temporal separation of two or more reactants.

Key Applications: high-k gate oxides, capacitors, solar cells, organic semiconductors, microfluidic, MEMS, Bio MEMS, memristors

Date and venue: Feb. 11, 9:30 am, IATL 104

Training details:

Lecture: 9:30 – 10:45 am

Outline: Intro. to Plasma and Thermal ALD techniques

                Overview of Oxford ALD Instruments

                ALD Processes

                Key Applications


Hands-on Lab: 11:00 – 1 pm (IATL 174)

Instructors: Shawn Xu Ph.D., (Process Engineer, Oxford Instruments America)

                 Aju Jugessur Ph.D., (Director, University of Iowa Microfabrication Facility)

Register here

Program details here


Individuals with disabilities are encouraged to attend all University of Iowa sponsored events. If you are a person with a disability who requires an accommodation in order to attend this program, please contact the Optical Science & Technology Center in advance at 353-0974 or email