University of Iowa - Microfabrication Facility
ATOMIC LAYER DEPOSITION
Atomic Layer Deposition (ALD) is a “Nano” technology, allowing thin films of a few nanometers to be deposited in a precisely controlled way.
Atomic Layer Deposition (ALD) is a thin film deposition technique that is based on the sequential, self-limiting surface reaction based on the temporal separation of two or more reactants.
Key Applications: high-k gate oxides, capacitors, solar cells, organic semiconductors, microfluidic, MEMS, Bio MEMS, memristors
Date and venue: Feb. 11, 9:30 am, IATL 104
Lecture: 9:30 – 10:45 am